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National Stock Number:
5961-01-245-3669
Federal Supply Class:
5961
National Item Identification Number:
012453669
Description:
SEMICONDUCTOR DEVICES,UNITIZED
Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
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Manufacturer Information:
| 44-038313-01 | 26916 | NORTHROP GRUMMAN SYSTEMS CORPORATION | | 44-054259-01 | 26916 | NORTHROP GRUMMAN SYSTEMS CORPORATION | | 839233-0012 | 06481 | NORTHROP GRUMMAN SYSTEMS CORPORATION | | 7568204-001 | 13160 | GENERAL DYNAMICS LAND SYSTEMS INC. | | DH3467CD-883B | 27014 | NATIONAL SEMICONDUCTOR CORPORATION | | DH3467CN | 27014 | NATIONAL SEMICONDUCTOR CORPORATION | | MHQ3467HXV | 04713 | FREESCALE SEMICONDUCTOR, INC. | | FPQ3467 | 07263 | FAIRCHILD SEMICONDUCTOR CORP | | SA2738 | 07933 | FAIRCHILD SEMICONDUCTOR CORP SEMICONDUCTOR DIV HQ | | MHQ3467HXV | 1S926 | AMERICAN MICROSEMICONDUCTOR INC | | DH3467D-MIL | 27014 | NATIONAL SEMICONDUCTOR CORPORATION | | DH3467D/883 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION | | HS5058-1001 | 8V613 | THE BOEING COMPANY |
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Techincal Specification:
| COMPONENT NAME AND QUANTITY | 4 TRANSISTOR | | CURRENT RATING PER CHARACTERISTIC | -1.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC ALL TRANSISTOR | | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE | | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 | | MATERIAL | CERAMIC ENCLOSURE | | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR | | MOUNTING METHOD | PRESS FIT | | OVERALL HEIGHT | 0.200 INCHES MAXIMUM | | OVERALL LENGTH | 0.785 INCHES MAXIMUM | | OVERALL WIDTH | 0.325 INCHES MAXIMUM | | SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP | | POWER RATING PER CHARACTERISTIC | 6.3 WATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR | | SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR | | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD | | TRANSFER RATIO | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER ALL TRANSISTOR | | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -40.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE, DC AND -40.0 MAXIMUM COLLECTOR TO BASE VOLTAGE, DC AND -5.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC ALL TRANSISTOR |
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