COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET ALL SEMICONDUCTOR DEVICE DIODE |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3 |
INCLOSURE MATERIAL | METAL |
PROPRIETARY CHARACTERISTICS | PACS |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
MOUNTING FACILITY QUANTITY | 2 |
MOUNTING METHOD | UNTHREADED HOLE |
OVERALL HEIGHT | 0.450 INCHES MAXIMUM |
OVERALL LENGTH | 1.573 INCHES MAXIMUM |
OVERALL WIDTH | 1.050 INCHES MAXIMUM |
SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS ALL SEMICONDUCTOR DEVICE DIODE |
TERMINAL TYPE AND QUANTITY | 4 PIN AND 1 CASE |